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- Part Number SI1967DH-T1-GE3
- Manufacturer Vishay
- Pin Count 6
- Part Category Transistor
- Package Category SOT23 (6-Pin)
- Footprint Name SOT23 (6-Pin) - SC-70 6 LEADS
- Released Date Oct 23, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI1967DH-T1-GE3 Details
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Manufacturer Part Number:
SI1967DH-T1-GE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
HALOGEN FREE AND ROHS COMPLIANT, SC-70, 6 PIN
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Country Of Origin:
Germany
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ECCN Code:
EAR99
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Factory Lead Time:
15 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
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Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
20 V
SI1967DH-T1-GE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SI1967DH-T1-GE3 is a 5-pin SOT23 package with a 1.6mm x 2.9mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
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To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
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The SI1967DH-T1-GE3 is capable of delivering up to 1A of continuous output current. However, it's recommended to limit the output current to 0.8A for optimal reliability and thermal performance.
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To ensure reliable operation, it's essential to provide adequate thermal management for the SI1967DH-T1-GE3. A thermal pad on the underside of the package should be connected to a copper plane on the PCB to dissipate heat. A maximum junction temperature of 150°C should not be exceeded.
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Yes, to minimize noise and ensure reliable operation, it's recommended to keep the input and output traces as short as possible, and to use a solid ground plane underneath the device. Additionally, avoid routing high-frequency signals near the device to minimize electromagnetic interference.
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SI1967DH-T1-GE3 Overview
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