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SI2300DS-T1-BE3 - Vishay

Description: N-Channel 30 V 3.1A (Ta), 3.6A (Tc) 1.1W (Ta), 1.7W (Tc) Surface Mount SOT-23-3 (TO-236)

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Symbol
SI2300DS-T1-BE3 - Vishay - PCB symbol
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PCB Footprints
SI2300DS-T1-BE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23-4
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3D Models
SI2300DS-T1-BE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT23-4
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SI2300DS-T1-BE3 Details

  • Manufacturer Part Number:

    SI2300DS-T1-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.6 A

  • Drain-source On Resistance-Max:

    0.068 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    19 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2300DS-T1-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2300DS-T1-BE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
  • The maximum operating temperature range for the SI2300DS-T1-BE3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • To prevent ESD damage, handle the SI2300DS-T1-BE3 with an anti-static wrist strap or mat, and ensure the PCB is properly grounded. Avoid touching the component pins or handling the component in close proximity to ESD-sensitive areas.
  • A 10 μF ceramic capacitor in parallel with a 100 nF ceramic capacitor is recommended for power supply decoupling, placed as close as possible to the SI2300DS-T1-BE3.

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SI2300DS-T1-BE3 Overview

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