- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI2301BDS-T1-BE3
- Part Number SI2301BDS-T1-BE3
- Manufacturer Vishay
- Pin Count 3
- Part Category Integrated Circuit
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - sot-23-ren5
- Released Date Sep 19, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI2301BDS-T1-BE3 Details
-
Manufacturer Part Number:
SI2301BDS-T1-BE3
-
Rohs Code:
Yes
-
Part Life Cycle Code:
Obsolete
-
Package Description:
TO-236, SOT-23, 3 PIN
-
ECCN Code:
EAR99
-
Manufacturer:
Vishay Intertechnologies
-
YTEOL:
0
-
Configuration:
SINGLE WITH BUILT-IN DIODE
-
DS Breakdown Voltage-Min:
20 V
-
Drain Current-Max (ID):
2.2 A
-
Drain-source On Resistance-Max:
0.1 Ω
SI2301BDS-T1-BE3 Frequently Asked Questions (FAQs)
-
A good PCB layout for the SI2301BDS-T1-BE3 should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2 oz copper thickness is recommended.
-
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
-
The SI2301BDS-T1-BE3 is a sensitive semiconductor device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap, mat, or workstation, and follow standard ESD handling precautions to prevent damage.
-
Yes, the SI2301BDS-T1-BE3 is suitable for high-frequency switching applications. However, ensure that the device is properly bypassed with capacitors and that the PCB layout is optimized for high-frequency operation. Additionally, consider the device's switching characteristics and ensure that it meets the requirements of your specific application.
-
The recommended soldering conditions for the SI2301BDS-T1-BE3 are a peak temperature of 260°C for 10 seconds, with a soldering iron temperature of 350°C. For rework, use a low-temperature soldering iron and a solder wick or vacuum desoldering tool to minimize thermal stress on the device.
Trust Checks
Community Provided
System Verified
Community Approved
SI2301BDS-T1-BE3 Overview
Use the download button to access the SI2301BDS-T1-BE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SI230,
or try a keyword search, such as Small Signal Field-Effect Transistors
Suggested Parts
If you searched for SI2301BDS-T1-BE3, you might also be interested in these parts:
| Part Number |
|---|
| MLX90363LDC-ABB-000-SP |
| SI2300DS-T1-GE3 |
| STM8L101K3T6 |
| SI2301 |
| SYN480R |
| SD0805S020S1R0 |
| SI2300-TP |
| ADTT1-6+ |
| LT3021ES8#TRPBF |