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SI2301CDS-T1-GE3 - Vishay

Description: SI2301CDS-T1-GE3, P-channel MOSFET Transistor 2.3 A 20 V, 3-Pin SOT-23, TO-236

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Symbol
SI2301CDS-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI2301CDS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2301CDS-T1-GE3
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3D Models
SI2301CDS-T1-GE3 - Vishay - 3D model - SOT23 (3-Pin) - SI2301CDS-T1-GE3
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SI2301CDS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2301CDS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.1 A

  • Drain-source On Resistance-Max:

    0.112 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2301CDS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2301CDS-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the VCC pin to a stable 2.5V to 5.5V power supply, and the GND pin to a solid ground plane. Additionally, decouple the VCC pin with a 10nF to 100nF capacitor to reduce noise and ensure stable operation.
  • The maximum allowable power dissipation for the SI2301CDS-T1-GE3 is 250mW. Ensure that the device is properly heat-sinked and operated within the recommended temperature range to prevent overheating.
  • To protect the SI2301CDS-T1-GE3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD-protection diodes or resistors.
  • The recommended operating temperature range for the SI2301CDS-T1-GE3 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

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SI2301CDS-T1-GE3 Overview

Use the download button to access the SI2301CDS-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for SI2301CDS-T1-GE3, check out Findchips.com