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SI2302 - MCC

Description: Small Signal MOSFETS

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Symbol
SI2302 - MCC - PCB symbol
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PCB Footprints
SI2302 - MCC PCB footprint - Other - Other - SI2302-3
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3D Models
SI2302 - MCC - 3D model - Other - SI2302-3
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SI2302 Details

  • Manufacturer Part Number:

    SI2302

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    4

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    45 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.25 W

  • Power Dissipation-Max (Abs):

    1.25 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    140 ns

  • Turn-on Time-Max (ton):

    75 ns

SI2302 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI2302 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The EN pin should be tied to a logic high or low depending on the desired state of the switch. Additionally, ensure that the input and output capacitors are properly sized and placed.
  • The maximum current rating of the SI2302 is 2A, but this can vary depending on the specific application and operating conditions. It's recommended to check the datasheet and perform thermal calculations to ensure the device can handle the required current.
  • To protect the SI2302 from overvoltage and overcurrent conditions, consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits to the design. These can include components such as TVS diodes, zener diodes, and current-sensing resistors.
  • The typical rise and fall time of the SI2302 switch is around 10-20 ns, but this can vary depending on the specific application and operating conditions. It's recommended to check the datasheet and perform simulations to ensure the device meets the required switching times.

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SI2302 Overview

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SI2302 Alternates

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Part Image SI2302-TP Micro Commercial Components

Power Field-Effect Transistor, 3A I(D), 20V, 0.027ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET