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SI2303CDS-T1-BE3 - Vishay

Description: P-Channel 30 V 1.9A (Ta), 2.7A (Tc) 1W (Ta), 2.3W (Tc) Surface Mount SOT-23-3 (TO-236)

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Symbol
SI2303CDS-T1-BE3 - Vishay - PCB symbol
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PCB Footprints
SI2303CDS-T1-BE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)_2020
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3D Models
SI2303CDS-T1-BE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)_2020
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SI2303CDS-T1-BE3 Details

  • Manufacturer Part Number:

    SI2303CDS-T1-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Country Of Origin:

    Germany, Taiwan, Usa

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.19 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.3 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2303CDS-T1-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2303CDS-T1-BE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5V and 5.5V, and the VCC pin to a stable voltage source between 1.8V and 5.5V. Ensure the voltage difference between VIN and VCC does not exceed 1.5V.
  • The maximum allowable power dissipation for the SI2303CDS-T1-BE3 is 250mW. Ensure the device is properly heat-sinked and operated within the recommended temperature range to prevent overheating.
  • Handle the SI2303CDS-T1-BE3 with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. The device has an integrated ESD protection diode, but external ESD protection measures are still recommended.
  • The recommended storage temperature range for the SI2303CDS-T1-BE3 is -40°C to 125°C. Store the device in a dry, cool place, away from direct sunlight and moisture.

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SI2303CDS-T1-BE3 Overview

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