The recommended PCB footprint for the SI2309CDS-T1-BE3 is a 6-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 10 μF ceramic capacitor.
The SI2309CDS-T1-BE3 is rated for operation in an ambient temperature range of -40°C to +125°C.
Yes, the SI2309CDS-T1-BE3 is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications.
To calculate power dissipation, use the formula: Pd = (VIN - VOUT) x IOUT. Ensure the calculated power dissipation does not exceed the maximum rating of 1.5 W.
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SI2309CDS-T1-BE3 Overview
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