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SI2310-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SI2310-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2310-TP
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3D Models
SI2310-TP - MCC  - 3D model - SOT23 (3-Pin) - SI2310-TP
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SI2310-TP Details

  • Manufacturer Part Number:

    SI2310-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.4

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    19.5 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.2 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2310-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI2310-TP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and decouple it with a 10uF capacitor. The VCC pin should be connected to a clean power source, and the GND pin should be connected to a solid ground plane.
  • The SI2310-TP can operate up to 100 MHz, but the maximum operating frequency depends on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for specific frequency-related information.
  • The SI2310-TP has built-in ESD protection, but it's still recommended to take precautions during handling and assembly. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die.
  • The thermal resistance of the SI2310-TP package is typically around 150°C/W. However, this value can vary depending on the specific application and PCB design. It's recommended to consult the datasheet and thermal management guidelines for specific information.

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SI2310-TP Overview

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