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SI2318A-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SI2318A-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2318A-TP
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3D Models
SI2318A-TP - MCC  - 3D model - SOT23 (3-Pin) - SI2318A-TP
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SI2318A-TP Details

  • Manufacturer Part Number:

    SI2318A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.06 Ω

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

SI2318A-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI2318A-TP involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to a logic high (VCC) to enable the device. The VIN pin should be connected to a stable input voltage source.
  • The maximum current rating of the SI2318A-TP is 1.5A. However, it's recommended to derate the current to 1.2A for reliable operation and to prevent overheating.
  • To protect the SI2318A-TP from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to regulate the input voltage. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • The thermal resistance of the SI2318A-TP package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.

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SI2318A-TP Overview

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