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SI2319DDS-T1-GE3 - Vishay

Description: Si2319DDS-T1-GE3 P-Channel MOSFET, 3.6 A, 40 V TrenchFET, 3-Pin SOT-23 Vishay Siliconix

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PCB Footprints
SI2319DDS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2319DDS-T1-GE3-1
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3D Models
SI2319DDS-T1-GE3 - Vishay  - 3D model - SOT23 (3-Pin) - SI2319DDS-T1-GE3-1
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SI2319DDS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2319DDS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    1.25 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    3.6 A

  • Drain-source On Resistance-Max:

    0.075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    43 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    60 ns

  • Turn-on Time-Max (ton):

    93 ns

SI2319DDS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2319DDS-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure the device operates within the recommended operating conditions, maintain a junction temperature (TJ) between -40°C to 150°C, and an ambient temperature (TA) between -40°C to 85°C. Also, ensure the input voltage (VIN) is within the recommended range of 2.5V to 5.5V.
  • The maximum allowed power dissipation for the SI2319DDS-T1-GE3 is 1.4 W at an ambient temperature of 70°C, and 0.7 W at an ambient temperature of 85°C.
  • To handle ESD protection for the SI2319DDS-T1-GE3, follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. The device has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM).
  • The recommended storage condition for the SI2319DDS-T1-GE3 is in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 60%.

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SI2319DDS-T1-GE3 Overview

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