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SI2319DS-T1-BE3 - Vishay

Description: MOSFET P-CHANNEL 40-V (D-S)

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SI2319DS-T1-BE3 - Vishay - PCB symbol
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PCB Footprints
SI2319DS-T1-BE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)_2020
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3D Models
SI2319DS-T1-BE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)_2020
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SI2319DS-T1-BE3 Details

  • Manufacturer Part Number:

    SI2319DS-T1-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    2.3 A

  • Drain-source On Resistance-Max:

    0.082 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    65 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    40 ns

SI2319DS-T1-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2319DS-T1-BE3 is a 2x2 array of 0.5mm x 0.5mm pads with a 1.3mm x 1.3mm thermal pad in the center. Refer to the Vishay Intertechnologies application note AN81142 for more details.
  • To ensure proper soldering, use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Avoid using wave soldering or hand soldering, as it may damage the device. Refer to the Vishay Intertechnologies application note AN81142 for more details.
  • The SI2319DS-T1-BE3 is rated for operation from -55°C to 150°C (TJ). However, the device's performance may degrade above 125°C. Ensure proper thermal management to maintain a junction temperature below 125°C for optimal performance.
  • Yes, the SI2319DS-T1-BE3 is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP capable. However, ensure you follow the recommended design and manufacturing guidelines to meet the specific requirements of your application.
  • Store the SI2319DS-T1-BE3 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Follow the ESD handling guidelines outlined in the Vishay Intertechnologies application note AN81142.

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SI2319DS-T1-BE3 Overview

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