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SI2323DS-T1-GE3 - Vishay

Description: VISHAY - SI2323DS-T1-GE3 - P CHANNEL MOSFET, -20V, 4.7A TO-236, FULL REEL

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Symbol
SI2323DS-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI2323DS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2323DS-T1-GE3
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3D Models
SI2323DS-T1-GE3 - Vishay - 3D model - SOT23 (3-Pin) - SI2323DS-T1-GE3
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SI2323DS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2323DS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.7 A

  • Drain-source On Resistance-Max:

    0.039 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    140 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    185 ns

  • Turn-on Time-Max (ton):

    105 ns

SI2323DS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2323DS-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure the SI2323DS-T1-GE3 operates within the specified junction temperature range, provide adequate heat sinking, use a thermally conductive PCB material, and avoid excessive power dissipation. A thermal pad or heat sink can be added to the PCB design to improve heat dissipation.
  • The maximum allowed voltage on the enable pin (EN) of the SI2323DS-T1-GE3 is 6V. Exceeding this voltage may damage the device.
  • Yes, the SI2323DS-T1-GE3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade and is suitable for use in harsh environments.
  • To prevent ESD damage, handle the SI2323DS-T1-GE3 with an anti-static wrist strap or mat, and ensure the PCB is properly grounded. Avoid touching the device pins or handling the device in environments with high electrostatic potential.

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SI2323DS-T1-GE3 Overview

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