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SI2336DS-T1-GE3 - Vishay

Description: VISHAY - SI2336DS-T1-GE3 - MOSFET,N CH,30V,5.2A,DIODE,SOT23

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PCB Footprints
SI2336DS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)
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3D Models
SI2336DS-T1-GE3 - Vishay  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)
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SI2336DS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2336DS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.2 A

  • Drain-source On Resistance-Max:

    0.042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2336DS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2336DS-T1-GE3 is a 3x3mm QFN package with a 0.5mm pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-40°C to 125°C). Additionally, provide adequate thermal management, such as heat sinks or thermal pads, to prevent overheating.
  • The maximum allowable voltage on the input pins of the SI2336DS-T1-GE3 is 5.5V. Exceeding this voltage may cause damage to the device.
  • To prevent ESD damage, handle the SI2336DS-T1-GE3 with ESD-protective equipment, such as wrist straps or anti-static bags. Ensure that the device is stored in a conductive bag or container when not in use.
  • The recommended soldering profile for the SI2336DS-T1-GE3 is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

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SI2336DS-T1-GE3 Overview

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Small Signal Field-Effect Transistor, 5.2A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236

Part Image SI2334DS-T1-GE3 Vishay Intertechnologies

Small Signal Field-Effect Transistor, 4.9A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236