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SI2374DS-T1-GE3 - Vishay

Description: VISHAY - SI2374DS-T1-GE3 - MOSFET, N-CH, 20V, 5.9A, SOT-23

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Symbol
SI2374DS-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI2374DS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)
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3D Models
SI2374DS-T1-GE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)
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SI2374DS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2374DS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.9 A

  • Drain-source On Resistance-Max:

    0.03 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2374DS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2374DS-T1-GE3 is a 2x2mm QFN package with a 0.5mm pitch. A minimum of 4 layers is recommended for optimal thermal performance.
  • To ensure the device operates within the specified junction temperature range, provide a thermal path from the device to a heat sink or a metal pad on the PCB. Use thermal interface material (TIM) to fill any air gaps between the device and the heat sink.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • The SI2374DS-T1-GE3 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consult the datasheet for thermal derating information.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and PCB layout for any noise or interference. Verify that the device is properly configured and that the output capacitor is within the recommended specifications.

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SI2374DS-T1-GE3 Overview

Use the download button to access the SI2374DS-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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