- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI3127DV-T1-GE3
- Part Number SI3127DV-T1-GE3
- Manufacturer Vishay
- Pin Count 6
- Part Category MOSFET (P-Channel)
- Package Category SOT23 (6-Pin)
- Footprint Name SOT23 (6-Pin) - MO-193C
- Released Date Nov 5, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI3127DV-T1-GE3 Details
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Manufacturer Part Number:
SI3127DV-T1-GE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
HALOGEN FREE AND ROHS COMPLIANT, MO-193C, TSOP-6
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Country Of Origin:
Israel
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ECCN Code:
EAR99
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
60 V
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Drain Current-Max (ID):
5.1 A
SI3127DV-T1-GE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SI3127DV-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
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To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5 V and 5.5 V, and the VOUT pin to a load impedance of at least 1 kΩ. Also, ensure the EN pin is tied to a logic high (VIN) to enable the device.
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The SI3127DV-T1-GE3 is rated for operation from -40°C to 125°C (junction temperature). However, the device can be operated up to 150°C with derating.
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To prevent ESD damage, handle the SI3127DV-T1-GE3 with an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or tube. Avoid touching the device's pins or leads.
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Yes, the SI3127DV-T1-GE3 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and design guidelines to ensure optimal performance and reliability.
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SI3127DV-T1-GE3 Overview
Use the download button to access the SI3127DV-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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