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SI3459BDV-T1-BE3 - Vishay

Description: MOSFET P-CHANNEL 60-V (D-S)

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SI3459BDV-T1-BE3 - Vishay - PCB symbol
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PCB Footprints
SI3459BDV-T1-BE3 - Vishay PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP 6 LEAD
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3D Models
SI3459BDV-T1-BE3 - Vishay - 3D model - SOT23 (6-Pin) - TSOP 6 LEAD
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SI3459BDV-T1-BE3 Details

  • Manufacturer Part Number:

    SI3459BDV-T1-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MO-193C, TSOP-6

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.9 A

  • Drain-source On Resistance-Max:

    0.216 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    30 pF

  • JEDEC-95 Code:

    MO-193AA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.3 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI3459BDV-T1-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI3459BDV-T1-BE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure the SI3459BDV-T1-BE3 operates within its SOA, follow the recommended operating conditions, including voltage, current, and power dissipation. Monitor the device's junction temperature and ensure it does not exceed the maximum rated temperature of 150°C.
  • For optimal thermal management, use a thermal pad on the PCB, ensure good airflow, and consider using a heat sink or thermal interface material (TIM) if the device is expected to operate at high temperatures or high power levels.
  • To prevent electrostatic discharge (ESD) damage, handle the SI3459BDV-T1-BE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe and follow proper handling procedures.
  • For optimal soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. Ensure the PCB is clean and free of oxidation.

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SI3459BDV-T1-BE3 Overview

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