The recommended PCB footprint for the SI3469DV-T1-E3 is a 3x3mm QFN package with a 0.5mm pitch. A minimum of 2mm clearance around the device is recommended for thermal and electrical considerations.
To ensure the SI3469DV-T1-E3 operates within its recommended operating conditions, maintain a junction temperature (TJ) below 150°C, and provide a stable input voltage within the recommended range of 2.5V to 5.5V. Additionally, ensure the device is operated within the recommended current limits and thermal design power (TDP).
The maximum allowable power dissipation for the SI3469DV-T1-E3 is 1.4W. However, this value may vary depending on the specific application and operating conditions. It is essential to perform thermal analysis and design considerations to ensure the device operates within its recommended thermal limits.
Yes, the SI3469DV-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade devices and is suitable for use in harsh environments. However, it is essential to consult with Vishay Intertechnologies for specific application requirements and to ensure compliance with relevant industry standards.
To prevent damage and ensure the reliability of the SI3469DV-T1-E3, store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body, avoiding contact with the pins or electrical connections.
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SI3469DV-T1-E3 Overview
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