SI3552DV-T1-GE3 footprint, schematic symbol and 3D model by Vishay

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Part Number SI3552DV-T1-GE3
Manufacturer Vishay
Pin Count 6
Part Category Transistor
Package Category SOT23 (6-Pin)
Footprint Name SOT23 (6-Pin) - 6-LEAD TSOP
Released Date Jul 22, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SI3552DV-T1-GE3 Details

Manufacturer Part Number:
SI3552DV-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
TSOP-6
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
0
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
2.5 A
Drain-source On Resistance-Max:
0.105 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
MO-193AA
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL AND P-CHANNEL
Pulsed Drain Current-Max (IDM):
8 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
28 ns
Turn-on Time-Max (ton):
25 ns

SI3552DV-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the SI3552DV-T1-GE3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for each pin.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V and 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor.
The SI3552DV-T1-GE3 is capable of delivering up to 150mA of output current. However, it's recommended to limit the output current to 100mA for optimal performance and to prevent overheating.
To ensure proper thermal management, provide a minimum of 1 square inch of copper area on the PCB for heat dissipation. Additionally, consider using thermal vias and a thermal pad on the bottom of the PCB to improve heat transfer.
Yes, the SI3552DV-T1-GE3 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions and ensure the device is properly derated for high-temperature operation.

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SI3552DV-T1-GE3 Overview

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SI3552DV-T1-GE3 - Vishay

SI3552DV-T1-GE3 Details

SI3552DV-T1-GE3 Frequently Asked Questions (FAQs)

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SI3552DV-T1-GE3 Overview

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