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SI4101DY-T1-GE3 - Vishay

Description: MOSFET -30V Vds 20V Vgs SO-8

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SI4101DY-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI4101DY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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3D Models
SI4101DY-T1-GE3 - Vishay - 3D model - Small Outline Packages - SO8
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SI4101DY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4101DY-T1-GE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOIC-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    25.7 A

  • Drain-source On Resistance-Max:

    0.006 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI4101DY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4101DY-T1-GE3 is a 1.6mm x 0.8mm pad with a 0.5mm hole in the center, and a 0.3mm keep-out zone around the pad.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum operating temperature range for the SI4101DY-T1-GE3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • To handle ESD protection, use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the device or PCB with bare hands, and use ESD-safe packaging and handling procedures.
  • The recommended reflow soldering profile for the SI4101DY-T1-GE3 is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.

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SI4101DY-T1-GE3 Overview

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