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SI4162DY-T1-GE3 - Vishay

Description: SI4162DY-T1-GE3, N-channel MOSFET Transistor 13.6 A 30 V, 8-Pin SOIC

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Symbol
SI4162DY-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI4162DY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow SOIC
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3D Models
SI4162DY-T1-GE3 - Vishay - 3D model - Small Outline Packages - 8-Pin Narrow SOIC
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SI4162DY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4162DY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOIC-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    48 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    19.3 A

  • Drain-source On Resistance-Max:

    0.0079 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Pulsed Drain Current-Max (IDM):

    70 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    55 ns

  • Turn-on Time-Max (ton):

    55 ns

SI4162DY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4162DY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure the SI4162DY-T1-GE3 operates within its SOA, ensure the maximum voltage rating is not exceeded, and the device is not exposed to excessive temperatures. Also, follow the recommended PCB layout and thermal management guidelines to minimize thermal resistance.
  • The maximum allowed power dissipation for the SI4162DY-T1-GE3 is 1.4 W at an ambient temperature of 25°C. However, this value may vary depending on the specific application and operating conditions.
  • Yes, the SI4162DY-T1-GE3 is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is suitable for use in harsh environments.
  • Handle the SI4162DY-T1-GE3 with care to prevent mechanical damage. Store the devices in their original packaging or in a protective container to prevent moisture and physical damage. Follow the recommended storage and shipping guidelines to ensure the devices remain functional.

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SI4162DY-T1-GE3 Overview

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