- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI4501BDY-T1-GE3
- Part Number SI4501BDY-T1-GE3
- Manufacturer Vishay
- Pin Count 8
- Part Category Undefined or Miscellaneous
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012
- Released Date Jan 12, 2017
- Last Modified Date Nov 15, 2024 1:35 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI4501BDY-T1-GE3 Details
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Manufacturer Part Number:
SI4501BDY-T1-GE3
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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ECCN Code:
EAR99
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Factory Lead Time:
111 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
0
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Drain Current-Max (ID):
12 A
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FET Technology:
METAL-OXIDE SEMICONDUCTOR
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JESD-609 Code:
e3
SI4501BDY-T1-GE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SI4501BDY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a 0.5 mm spacing between pads.
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To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
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The maximum operating temperature range for the SI4501BDY-T1-GE3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
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To handle ESD protection, use an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, including the use of ESD-sensitive component handling and storage procedures.
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The recommended power supply decoupling for the SI4501BDY-T1-GE3 is to use a 10 μF ceramic capacitor in parallel with a 100 nF ceramic capacitor, placed as close as possible to the device.
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SI4501BDY-T1-GE3 Overview
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