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SI4554DY-T1-GE3 - Vishay

Description: Vishay SI4554DY-T1-GE3 Dual N/P-channel MOSFET Transistor, 8-Pin SOIC

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SI4554DY-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI4554DY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW): 8-LEAD
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3D Models
SI4554DY-T1-GE3 - Vishay - 3D model - Small Outline Packages - SOIC (NARROW): 8-LEAD
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SI4554DY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4554DY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOIC-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.07

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SI4554DY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4554DY-T1-GE3 is a 1.6mm x 0.8mm pad with a 0.5mm radius corner, and a 0.3mm x 0.3mm thermal pad.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum operating temperature range for the SI4554DY-T1-GE3 is -55°C to 150°C, with a storage temperature range of -55°C to 150°C.
  • To prevent electrostatic discharge (ESD) damage, handle the SI4554DY-T1-GE3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • The recommended power sequencing for the SI4554DY-T1-GE3 is to power up the VCC pin first, followed by the VIN pin. Ensure that the VCC pin is powered up before the VIN pin to prevent damage to the device.

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SI4554DY-T1-GE3 Overview

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