SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
5.8 A
Drain-source On Resistance-Max:
0.0185 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
MS-012AA
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
1 W
Pulsed Drain Current-Max (IDM):
30 A
Reference Standard:
IEC-61249-2-21
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
55 ns
Turn-on Time-Max (ton):
32 ns
SI4816BDY-T1-E3 Frequently Asked Questions (FAQs)
The recommended PCB footprint for the SI4816BDY-T1-E3 is a 5x5mm QFN package with a 0.5mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN81142.
To ensure the SI4816BDY-T1-E3 operates within its recommended operating conditions, maintain a junction temperature (TJ) below 150°C, and keep the input voltage (VIN) between 2.7V and 5.5V. Also, ensure the output current (IOUT) does not exceed 1.5A.
The thermal resistance (θJA) of the SI4816BDY-T1-E3 is 45°C/W. This value represents the thermal resistance from the junction to the ambient air.
Yes, the SI4816BDY-T1-E3 is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its recommended specifications.
To troubleshoot issues with the SI4816BDY-T1-E3, start by verifying the input voltage, output voltage, and output current. Check for any signs of overheating, and ensure the device is properly soldered to the PCB. If issues persist, consult the datasheet and application notes or contact Vishay Intertechnologies' technical support for further assistance.
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SI4816BDY-T1-E3 Overview
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