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SI4862DY-T1-E3 - Vishay

Description: MOSFET 16 Volt 25 Amp 3.5W

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PCB Footprints
SI4862DY-T1-E3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW): 8-LEAD
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3D Models
SI4862DY-T1-E3 - Vishay  - 3D model - Small Outline Packages - SOIC (NARROW): 8-LEAD
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SI4862DY-T1-E3 Details

  • Manufacturer Part Number:

    SI4862DY-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    16 V

  • Drain Current-Max (ID):

    17 A

  • Drain-source On Resistance-Max:

    0.0033 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI4862DY-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4862DY-T1-E3 is a standard SO-8 package with a minimum pad size of 1.5 mm x 1.5 mm and a maximum pad size of 2.5 mm x 2.5 mm, with a 0.5 mm spacing between pads.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Use a reflow oven or a hot air soldering station to achieve a smooth, even solder flow.
  • The maximum operating temperature range for the SI4862DY-T1-E3 is -55°C to 150°C, with a junction temperature (TJ) of 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • Yes, the SI4862DY-T1-E3 is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using a qualified automotive process. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the specific application requirements.
  • To prevent electrostatic discharge (ESD) damage, handle the SI4862DY-T1-E3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Use ESD-safe packaging and storage materials, and avoid touching the device's pins or exposed internal components.

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SI4862DY-T1-E3 Overview

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