SI4900DY-T1-E3 footprint, schematic symbol and 3D model by Vishay

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Part Number SI4900DY-T1-E3
Manufacturer Vishay
Pin Count 8
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - 8-Pin Narrow SOIC
Released Date Apr 13, 2015
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SI4900DY-T1-E3 Details

Manufacturer Part Number:
SI4900DY-T1-E3
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
MS-012, SOP-8
ECCN Code:
EAR99
Manufacturer:
Vishay Intertechnologies
YTEOL:
0
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
5.3 A
Drain-source On Resistance-Max:
0.058 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
MS-012AA
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
3.1 W
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

SI4900DY-T1-E3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the SI4900DY-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 1.3mm x 1.3mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure the SI4900DY-T1-E3 operates within its SOA, ensure the maximum voltage rating is not exceeded, and the device is not exposed to excessive temperatures. Also, follow the recommended PCB layout and thermal management guidelines.
The maximum allowed power dissipation for the SI4900DY-T1-E3 is 1.4W at an ambient temperature of 25°C. However, this value may vary depending on the specific application and operating conditions.
Yes, the SI4900DY-T1-E3 is qualified for automotive and high-reliability applications. However, it's essential to review the device's AEC-Q100 qualification and follow the recommended design and testing guidelines for these applications.
To ensure proper thermal management, use a thermal pad on the PCB, and consider using a heat sink or thermal interface material. Also, ensure good airflow around the device and follow the recommended PCB layout guidelines.

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SI4900DY-T1-E3 Overview

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SI4900DY-T1-E3 - Vishay

SI4900DY-T1-E3 Details

SI4900DY-T1-E3 Frequently Asked Questions (FAQs)

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SI4900DY-T1-E3 Overview

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