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SI5902BDC-T1-GE3 - Vishay

Description: Vishay SI5902BDC-T1-GE3 Dual N-channel MOSFET Transistor, 3.7 A, 30 V, 8-Pin 1206 ChipFET

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PCB Footprints
SI5902BDC-T1-GE3 - Vishay PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - 8-Pin 1206
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3D Models
SI5902BDC-T1-GE3 - Vishay  - 3D model - SO Transistor Flat Lead - 8-Pin 1206
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SI5902BDC-T1-GE3 Details

  • Manufacturer Part Number:

    SI5902BDC-T1-GE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, 1206-8, CHIPFET-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.12 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    60 ns

  • Turn-on Time-Max (ton):

    145 ns

SI5902BDC-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI5902BDC-T1-GE3 is a standard SOT23-6 package with a 1.6mm x 1.6mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V and 5.5V. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ground. Additionally, ensure the input and output pins are not overloaded, and the device is operated within the recommended temperature range.
  • The maximum allowed power dissipation for the SI5902BDC-T1-GE3 is 1.4W. Ensure the device is operated within this limit to prevent overheating and ensure reliable operation.
  • The SI5902BDC-T1-GE3 is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation and thermal resistance when operating in high-temperature environments. Ensure proper heat sinking and thermal management to prevent overheating.
  • To troubleshoot issues with the SI5902BDC-T1-GE3, start by verifying the input voltage and output voltage levels. Check for proper decoupling, and ensure the device is operated within the recommended temperature range. If issues persist, consult the datasheet and application notes or contact Vishay Intertechnologies' technical support.

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SI5902BDC-T1-GE3 Overview

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