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SI6423ADQ-T1-GE3 - Vishay

Description: MOSFET 20V P-CHANNEL (D-S)

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SI6423ADQ-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8
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SI6423ADQ-T1-GE3 - Vishay  - 3D model - Small Outline Packages - TSSOP-8
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SI6423ADQ-T1-GE3 Details

  • Manufacturer Part Number:

    SI6423ADQ-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2020-09-30

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    12.5 A

  • Drain-source On Resistance-Max:

    0.0098 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    555 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI6423ADQ-T1-GE3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI6423ADQ-T1-GE3 should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. Additionally, keeping the component placement and routing symmetrical can help reduce thermal gradients.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and keeping the device within its recommended operating temperature range. Additionally, consider using a thermal protection circuit to prevent overheating.
  • The recommended soldering conditions for the SI6423ADQ-T1-GE3 are a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering iron temperature of 350°C (662°F) maximum. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F).
  • While the SI6423ADQ-T1-GE3 is a high-performance device, it's essential to consult with Vishay Intertechnologies or a qualified representative to determine its suitability for high-reliability or aerospace applications. Additional testing, screening, and qualification may be required to meet the specific requirements of these industries.
  • To prevent electrostatic discharge (ESD) damage, handle the SI6423ADQ-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in its original packaging or an ESD-protective container when not in use. Follow proper ESD handling procedures, such as grounding yourself before handling the device.

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SI6423ADQ-T1-GE3 Overview

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