- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI6926ADQ-T1-E3
- Part Number SI6926ADQ-T1-E3
- Manufacturer Vishay
- Pin Count 8
- Part Category MOSFET (N-Channel)
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - TSSOP-8
- Released Date Aug 16, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI6926ADQ-T1-E3 Details
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Manufacturer Part Number:
SI6926ADQ-T1-E3
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
TSSOP-8
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ECCN Code:
EAR99
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
0
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Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
20 V
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Drain Current-Max (ID):
4.1 A
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Drain-source On Resistance-Max:
0.03 Ω
SI6926ADQ-T1-E3 Frequently Asked Questions (FAQs)
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For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a thermal relief pattern under the device. A minimum of 2 oz copper thickness is recommended. Additionally, ensure that the PCB has adequate thermal vias to dissipate heat efficiently.
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To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the device. Avoid using excessive solder or flux, as it can compromise the device's reliability.
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Store the SI6926ADQ-T1-E3 in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C. Avoid exposing the device to extreme temperatures, humidity, or physical stress.
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Yes, the SI6926ADQ-T1-E3 is suitable for high-reliability applications. It is manufactured using a robust process, and Vishay Intertechnologies provides a high level of quality control. However, it is essential to follow proper design, manufacturing, and testing procedures to ensure the device meets the required reliability standards.
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Handle the device by the body or the pins, avoiding touching the die or wire bonds. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. During testing, ensure that the device is properly secured to prevent mechanical stress or damage.
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SI6926ADQ-T1-E3 Overview
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