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SI7454FDP-T1-RE3 - Vishay

Description: N-Channel 100 V 7.2A (Ta), 23.5A (Tc) 3.6W (Ta), 39W (Tc) Surface Mount PowerPAK® SO-8

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SI7454FDP-T1-RE3 - Vishay - PCB symbol
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PCB Footprints
SI7454FDP-T1-RE3 - Vishay PCB footprint - Other - Other - SI7454FDP-T1-RE3-1
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3D Models
SI7454FDP-T1-RE3 - Vishay - 3D model - Other - SI7454FDP-T1-RE3-1
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SI7454FDP-T1-RE3 Details

  • Manufacturer Part Number:

    SI7454FDP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    11.25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    23.5 A

  • Drain-source On Resistance-Max:

    0.034 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    4 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    39 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    50 ns

  • Turn-on Time-Max (ton):

    62 ns

SI7454FDP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7454FDP-T1-RE3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-55°C to 150°C). Additionally, consider using a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device.
  • The maximum allowed voltage on the input pins of the SI7454FDP-T1-RE3 is 5.5V. Exceeding this voltage may damage the device.
  • Yes, the SI7454FDP-T1-RE3 is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI).
  • To prevent electrostatic discharge (ESD) damage, handle the SI7454FDP-T1-RE3 with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device pins or handling the device in environments with high humidity or static electricity.

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SI7454FDP-T1-RE3 Overview

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