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SI7456DP-T1-GE3 - Vishay

Description: MOSFET 100V 9.3A 5.2W 25mohm @ 10V

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SI7456DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1-1
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3D Models
SI7456DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® SO-8 Single_1-1
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SI7456DP-T1-GE3 Details

  • Manufacturer Part Number:

    SI7456DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    POWERPAK SO-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    5.7 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.9 W

  • Power Dissipation-Max (Abs):

    1.9 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    140 ns

  • Turn-on Time-Max (ton):

    60 ns

SI7456DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7456DP-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5V and 5.5V, and the VOUT pin to a capacitor (e.g., 1uF) to ground. Additionally, decouple the VIN pin with a 0.1uF capacitor to ground.
  • The SI7456DP-T1-GE3 is rated for operation from -40°C to 125°C (junction temperature). However, the device can be operated up to 150°C with derating.
  • Power dissipation (PD) can be calculated using the formula: PD = (VIN - VOUT) x IOUT. Ensure the calculated PD is within the maximum rating of 1.4W to prevent overheating.
  • A 1uF to 10uF ceramic capacitor is recommended for input decoupling, depending on the specific application requirements. A larger capacitor value may be needed for high-impedance sources or noisy input signals.

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SI7456DP-T1-GE3 Overview

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Part Image SI7456DP-T1 Vishay Intertechnologies

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