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SI7655DN-T1-GE3 - Vishay

Description: Vishay SI7655DN-T1-GE3 P-channel MOSFET Transistor, 40 A, -20 V, 8-Pin PowerPAK 1212

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PCB Footprints
SI7655DN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® 1212-8 Single_2-3
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3D Models
SI7655DN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® 1212-8 Single_2-3
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SI7655DN-T1-GE3 Details

  • Manufacturer Part Number:

    SI7655DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, 1212-8S, POWERPAK-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.0036 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7655DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7655DN-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 4.5 V and 18 V, and the enable pin (EN) to a logic-level signal (0 V or 5 V) to control the device's on/off state.
  • The maximum allowed power dissipation for the SI7655DN-T1-GE3 is 1.4 W at an ambient temperature of 25°C, with a thermal resistance (RθJA) of 57°C/W.
  • Yes, the SI7655DN-T1-GE3 is rated for operation up to 150°C, but the maximum junction temperature (TJ) should not exceed 175°C to ensure reliable operation.
  • To protect the SI7655DN-T1-GE3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays.

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SI7655DN-T1-GE3 Overview

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