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SI8800EDB-T2-E1 - Vishay

Description: N-Channel 20 V 2A (Ta) 500mW (Ta) Surface Mount 4-Microfoot -55 to +150 °C

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PCB Footprints
SI8800EDB-T2-E1 - Vishay PCB footprint - Other - Other - MICRO FOOT®: 4-Bump (0.8 mm x 0.8 mm, 0.4 mm Pitch)
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3D Models
SI8800EDB-T2-E1 - Vishay  - 3D model - Other - MICRO FOOT®: 4-Bump (0.8 mm x 0.8 mm, 0.4 mm Pitch)
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SI8800EDB-T2-E1 Details

  • Manufacturer Part Number:

    SI8800EDB-T2-E1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.80 X 0.80 MM, 0.35 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, ULTRA SMALL, MICRO FOOT, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.9 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI8800EDB-T2-E1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI8800EDB-T2-E1 is a 4-pad land pattern with a pitch of 0.5 mm and a pad size of 0.8 mm x 0.8 mm.
  • To ensure reliable soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Avoid overheating or applying excessive force, which can damage the device.
  • The maximum operating temperature range for the SI8800EDB-T2-E1 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To handle ESD protection, use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protective package. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • The recommended power-up sequence for the SI8800EDB-T2-E1 is to apply the power supply voltage (VCC) before applying the input signals. Ensure that the power supply voltage is stable and within the recommended range before applying input signals.

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SI8800EDB-T2-E1 Overview

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