Part Image

SI8802DB-T2-E1 - Vishay

Description: MOSFET 8V Vds 5V Vgs MICRO FOOT 0.8 x 0.8 N-Channel 8 V (D-S) MOSFET

Download SI8802DB-T2-E1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SI8802DB-T2-E1 - Vishay PCB footprint - Other - Other - SI8802DB-T2-E1-4
click to zoom
3D Models
SI8802DB-T2-E1 - Vishay  - 3D model - Other - SI8802DB-T2-E1-4
click to zoom

SI8802DB-T2-E1 Details

  • Manufacturer Part Number:

    SI8802DB-T2-E1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.80 X 0.80 MM, 0.40 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, MICRO FOOT, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    8 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.06 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.9 W

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI8802DB-T2-E1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI8802DB-T2-E1 is a 2x2mm QFN package with a 0.5mm pitch. A minimum of 2mm x 2mm pad size is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended operating temperature range (-40°C to 125°C). Additionally, provide adequate thermal management, such as heat sinks or thermal pads, to prevent overheating.
  • The maximum allowable voltage on the input pins of the SI8802DB-T2-E1 is 5.5V. Exceeding this voltage may cause damage to the device.
  • Yes, the SI8802DB-T2-E1 is suitable for high-frequency applications up to 100 MHz. However, ensure that the device is properly decoupled and that the PCB layout is optimized for high-frequency operation.
  • To handle ESD protection for the SI8802DB-T2-E1, ensure that the device is handled in an ESD-protected environment. Use ESD-protective packaging and handling equipment, and follow proper ESD-handling procedures during assembly and testing.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SI8802DB-T2-E1 Overview

Use the download button to access the SI8802DB-T2-E1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SI880, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to SI8802DB-T2-E1

Showing 0 results