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SIHB17N80E-GE3 - Vishay

Description: N-Channel 800 V 15A (Tc) 208W (Tc) Surface Mount TO-263 (D2PAK)

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PCB Footprints
SIHB17N80E-GE3 - Vishay PCB footprint - Other - Other - D2PAK (TO-263)_2025
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SIHB17N80E-GE3 - Vishay  - 3D model - Other - D2PAK (TO-263)_2025
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SIHB17N80E-GE3 Details

  • Manufacturer Part Number:

    SIHB17N80E-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, D2PAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.7

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    353 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.29 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    9 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    208 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    194 ns

  • Turn-on Time-Max (ton):

    92 ns

SIHB17N80E-GE3 Frequently Asked Questions (FAQs)

  • The recommended gate resistor value for SIHB17N80E-GE3 is typically between 10 ohms to 20 ohms, depending on the specific application and switching frequency. However, it's recommended to consult with Vishay's application notes or contact their technical support for more specific guidance.
  • While the SIHB17N80E-GE3 has a maximum junction temperature rating of 150°C, it's essential to consider the thermal management and heat dissipation in the system design. Vishay recommends derating the device's power handling capability at higher temperatures to ensure reliable operation.
  • To prevent damage to the gate oxide, it's crucial to follow proper handling and assembly procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, avoid touching the device's pins or exposing it to high-voltage static electricity.
  • Vishay provides guidelines for PCB layout and thermal design in their application notes and datasheets. Key considerations include minimizing thermal resistance, using thermal vias, and ensuring adequate copper area for heat dissipation. It's recommended to consult with Vishay's technical support or a qualified PCB design expert for specific guidance.
  • Yes, the SIHB17N80E-GE3 can be used in a parallel configuration to increase power handling. However, it's essential to ensure that the devices are properly matched, and the gate drive and control circuits are designed to accommodate the parallel configuration. Consult with Vishay's application notes or technical support for more information.

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