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SIHD180N60E-GE3 - Vishay

Description: MOSFET 650V Vds; 30V Vgs DPAK (TO-252)

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SIHD180N60E-GE3 - Vishay PCB footprint - Other - Other - SIHD180N60E-GE3-1
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SIHD180N60E-GE3 - Vishay  - 3D model - Other - SIHD180N60E-GE3-1
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SIHD180N60E-GE3 Details

  • Manufacturer Part Number:

    SIHD180N60E-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-09-17

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    88 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    19 A

  • Drain-source On Resistance-Max:

    0.195 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    156 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    64 ns

  • Turn-on Time-Max (ton):

    74 ns

SIHD180N60E-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SIHD180N60E-GE3 is a TO-247-3L package with a minimum pad size of 6.5mm x 4.5mm and a thermal pad size of 10mm x 10mm.
  • Yes, SIHD180N60E-GE3 is suitable for high-frequency switching applications up to 100 kHz due to its low gate charge and internal gate resistance.
  • To ensure reliable operation of SIHD180N60E-GE3 in high-temperature environments, it is recommended to use a heat sink with a thermal resistance of less than 1°C/W and to keep the junction temperature below 150°C.
  • The maximum allowed voltage derating for SIHD180N60E-GE3 is 80% of the maximum rated voltage (600V) at a junction temperature of 150°C.
  • Yes, SIHD180N60E-GE3 can be used in a parallel configuration, but it is recommended to ensure that the devices are matched in terms of their electrical characteristics and that the gate drive circuitry is designed to handle the increased gate capacitance.

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SIHD180N60E-GE3 Overview

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