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SIL08N03-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SIL08N03-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-1-9
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3D Models
SIL08N03-TP - MCC  - 3D model - SOT23 (6-Pin) - SOT23-1-9
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SIL08N03-TP Details

  • Manufacturer Part Number:

    SIL08N03-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

SIL08N03-TP Frequently Asked Questions (FAQs)

  • The maximum junction temperature that the SIL08N03-TP can withstand is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To ensure the SIL08N03-TP is properly biased, make sure to provide a stable voltage supply within the recommended operating range (VGS = 2-4V, VDS = 10-30V). Also, ensure that the gate-source voltage (VGS) is within the recommended range to avoid damage to the device.
  • For optimal thermal management, it's recommended to use a PCB with a thermal pad and a heat sink. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently. Additionally, ensure that the PCB layout is designed to minimize thermal resistance and provide good airflow around the device.
  • Yes, the SIL08N03-TP is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's capabilities.
  • To protect the SIL08N03-TP from ESD, handle the device with anti-static precautions, such as using an anti-static wrist strap or mat. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors.

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SIL08N03-TP Overview

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