Part Image

SIL2324A-TP - MCC

Description: Small Signal MOSFETS

Download SIL2324A-TP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SIL2324A-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6L (H=1.45mm)
click to zoom
3D Models
SIL2324A-TP - MCC  - 3D model - SOT23 (6-Pin) - SOT23-6L (H=1.45mm)
click to zoom

SIL2324A-TP Details

  • Manufacturer Part Number:

    SIL2324A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT23-6L, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

SIL2324A-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for SIL2324A-TP involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the traces to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • To ensure reliable operation of SIL2324A-TP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to 85°C.
  • The SIL2324A-TP has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device. This includes using ESD-safe workstations, wrist straps, and packaging materials.
  • Yes, the SIL2324A-TP is suitable for use in designs that require compliance with automotive or industrial standards, such as ISO 26262 or IEC 61508. However, it is recommended to consult with the manufacturer and perform additional testing and validation to ensure compliance with the specific standard requirements.
  • To troubleshoot issues with SIL2324A-TP, it is recommended to follow a systematic approach, including checking the power supply, signal integrity, and device configuration. Additionally, using diagnostic tools such as oscilloscopes, logic analyzers, and protocol analyzers can help identify the root cause of the issue.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SIL2324A-TP Overview

Use the download button to access the SIL2324A-TP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SIL23, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to SIL2324A-TP

Showing 0 results