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SIP32411DNP-T1-GE4 - Vishay

Description: Power Switch ICs - Power Distribution 2A 1.2V Slew Rate

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SIP32411DNP-T1-GE4 - Vishay PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN4 1.2 x 1.6
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3D Models
SIP32411DNP-T1-GE4 - Vishay  - 3D model - Small Outline No-lead - TDFN4 1.2 x 1.6
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SIP32411DNP-T1-GE4 Details

  • Manufacturer Part Number:

    SIP32411DNP-T1-GE4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • On-state Resistance-Max (Ron):

    0.072 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    220000 ns

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Palladium/Gold (Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

SIP32411DNP-T1-GE4 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Vishay's application note AN10343, which provides guidelines for PCB layout, thermal management, and component placement. Additionally, ensure a solid ground plane, use thermal vias, and keep the component away from heat sources.
  • Refer to the datasheet's application circuit and configuration examples. Ensure the input voltage and current meet the recommended operating conditions. Consult Vishay's application notes and technical support resources for specific guidance on biasing and configuration.
  • Vishay provides reliability data in the datasheet, including MTBF (Mean Time Between Failures) and FIT (Failures In Time) rates. For specific application expectations, consult Vishay's reliability reports and application notes. Additionally, consider environmental factors, operating conditions, and potential stressors that may impact device lifespan.
  • Start by reviewing the datasheet and application notes for troubleshooting guidelines. Check for proper component orientation, soldering, and PCB layout. Use oscilloscopes and logic analyzers to debug signal integrity issues. Consult Vishay's technical support resources and online forums for community-driven troubleshooting advice.
  • Yes, follow proper EMI/EMC design practices, such as using shielding, filtering, and grounding techniques. Ensure the device is placed away from noise sources and high-frequency signals. Consult Vishay's application notes and EMI/EMC guidelines for specific recommendations.

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