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SIP32433BDN-T1E4 - Vishay

Description: 3.5 A, 78 m?, 2.8 V to 23 V True Reverse Current Blocking eFuse With Programmable Current Limit and OVP

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SIP32433BDN-T1E4 - Vishay - PCB symbol
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PCB Footprints
SIP32433BDN-T1E4 - Vishay PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN-10 LEAD (3 X 3)
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3D Models
SIP32433BDN-T1E4 - Vishay - 3D model - Small Outline No-lead - DFN-10 LEAD (3 X 3)
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SIP32433BDN-T1E4 Details

  • Manufacturer Part Number:

    SIP32433BDN-T1E4

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-10

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:3.68A; THERMAL SHUTDOWN:165C; ADJUSTABLE CURRENT LIMIT

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    S-PDSO-N10

  • Length:

    3 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    1.05

  • Width:

    3 mm

SIP32433BDN-T1E4 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the package to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature rating.
  • The recommended soldering conditions for the SIP32433BDN-T1E4 are a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering iron temperature of 350°C (662°F) and a soldering time of 3 seconds maximum.
  • Yes, the SIP32433BDN-T1E4 is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB.
  • The recommended storage condition for the SIP32433BDN-T1E4 is to store it in a dry, cool place with a temperature range of -40°C to 125°C (-40°F to 257°F) and a relative humidity of 60% or less.

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SIP32433BDN-T1E4 Overview

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