Part Image

SK60GB123 - Semikron

Description: TRANSISTOR,IGBT POWER MODULE,HALF BRIDGE,1.2kV V(BR)CES,40A I(C)

Download SK60GB123 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SK60GB123 - Semikron PCB footprint - Other - Other - SK60GB123-3
click to zoom
3D Models
SK60GB123 - Semikron  - 3D model - Other - SK60GB123-3
click to zoom

SK60GB123 Details

  • Manufacturer Part Number:

    SK60GB123

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    10

  • Manufacturer Package Code:

    CASE T27

  • ECCN Code:

    EAR99

  • Manufacturer:

    SEMIKRON

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    58 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X5

  • JESD-609 Code:

    e2

  • Number of Elements:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN SILVER

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    455 ns

  • Turn-on Time-Nom (ton):

    90 ns

SK60GB123 Frequently Asked Questions (FAQs)

  • The recommended gate resistor value for SK60GB123 is typically between 10 ohms to 20 ohms, depending on the specific application and switching frequency. However, it's recommended to consult SEMIKRON's application notes or contact their technical support for more specific guidance.
  • To ensure proper thermal management for SK60GB123, it's essential to provide a good thermal interface between the module and the heat sink. Apply a thin layer of thermal interface material, ensure proper screw torque, and maintain a clean and flat heat sink surface. Additionally, consider using a heat sink with a high thermal conductivity and a sufficient surface area.
  • The maximum allowed voltage imbalance between the DC-link capacitors in SK60GB123 is typically around 10% to 15%. Exceeding this limit can lead to reduced module reliability and lifespan. It's recommended to use high-quality DC-link capacitors with low equivalent series resistance (ESR) and to ensure proper capacitor balancing and monitoring in the application.
  • Yes, SK60GB123 can be used in a parallel configuration to increase the power rating. However, it's essential to ensure that the modules are properly matched, and the gate drive signals are synchronized to prevent uneven current sharing. Additionally, the user should consider the increased complexity, thermal management, and potential for circulating currents in a parallel configuration.
  • The recommended storage temperature range for SK60GB123 is typically between -40°C to 40°C, with a relative humidity of less than 80%. It's essential to follow proper storage and handling procedures to prevent damage to the module.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SK60GB123 Overview

Use the download button to access the SK60GB123 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SK60G, or try a keyword search, such as IGBTs

Parts related to SK60GB123

Showing 0 results