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SL2S2002FTB - NXP

Description: IC, NXP, SL2S2002FTB, RL

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SL2S2002FTB Details

  • Manufacturer Part Number:

    SL2S2002FTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SON

  • Package Description:

    XSON-3

  • Pin Count:

    3

  • Country Of Origin:

    Malaysia, Thailand

  • HTS Code:

    8542.32.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e3

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.55 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

SL2S2002FTB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • NXP provides a component selection guide in the application note AN11542, which includes recommendations for capacitors, resistors, and inductors. Additionally, the NXP website offers a component selector tool to help engineers choose the correct components for their specific design.
  • The SL2S2002FTB has an operating temperature range of -40°C to 125°C, but it's essential to note that the device's performance and reliability may be affected at extreme temperatures. Engineers should consult the datasheet and application notes for specific guidance on temperature-related considerations.
  • NXP provides guidelines for EMC in the application note AN11542, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic radiation and susceptibility. Engineers should also consult the IEC 61000-4-x standards for EMC testing and compliance.
  • NXP recommends following the JEDEC J-STD-020D.1 standard for soldering the SL2S2002FTB. This standard provides guidelines for temperature profiling, soldering times, and moisture sensitivity to ensure reliable assembly and minimize the risk of damage during the soldering process.

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SL2S2002FTB Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like SL2S2, or try a keyword search, such as Other Telecom ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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