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SL2S2002FUD - NXP

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SL2S2002FUD - NXP  - 3D model
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SL2S2002FUD Details

  • Manufacturer Part Number:

    SL2S2002FUD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    WAFER

  • Package Description:

    WAFER-4

  • HTS Code:

    8542.32.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    X-XUUC-N4

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DIE

  • Package Shape:

    UNSPECIFIED

  • Package Style:

    UNCASED CHIP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UPPER

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SL2S2002FUD Overview

Use the download button to access the SL2S2002FUD 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SL2S2, or try a keyword search, such as Other Telecom ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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