SL3S1002FTB1,115 - NXP

SL3S1002FTB1,115 Details

• Manufacturer Part Number:

  SL3S1002FTB1,115

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SON

• Package Description:

  BCC, LCC3(UNSPEC)

• Pin Count:

  3

• Manufacturer Package Code:

  SOT1122

• Reach Compliance Code:

  Compliant

• HTS Code:

  8542.32.00

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• JESD-30 Code:

  R-PBCC-B3

• JESD-609 Code:

  e3

• Length:

  1.45 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  3

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BCC

• Package Equivalence Code:

  LCC3(UNSPEC)

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.5 mm

• Surface Mount:

  YES

• Technology:

  CMOS

• Telecom IC Type:

  TELECOM CIRCUIT

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  BUTT

• Terminal Pitch:

  0.55 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1 mm