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SLG59H1313C - Renesas Electronics

Description: The SLG59H1313C features a low 23 mΩ RDSON internal nFET and protects low‑voltage 2.5 Vdc to 5.5 Vdc operating systems against voltage faults up to 29 Vdc. An internal clamp circuit protects the downstream components from surge voltage up to 100 V. The SLG59H1313C features a fast 50 ns (typ) over‑voltage response time that turns off the internal nFET if the input voltage exceeds the OVP threshold. The OVP threshold is adjustable with optional external resistors to any voltage between 4 V and 20 V. Over‑temp

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SLG59H1313C - Renesas Electronics PCB footprint - BGA - BGA - 12-WLCSP
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SLG59H1313C - Renesas Electronics  - 3D model - BGA - 12-WLCSP
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SLG59H1313C Details

  • Manufacturer Part Number:

    SLG59H1313C

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-12 (1.3 x 1.8 mm)

  • Package Description:

    WLCSP-12

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    THERMAL SHUTDOWN:145C

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B12

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.3 mm

SLG59H1313C Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) for the SLG59H1313C. It suggests using a 4-layer PCB with a solid ground plane, placing thermal vias under the IC, and using a thermal pad on the bottom side of the PCB.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a heat sink or a fan to reduce the junction temperature.
  • The built-in OCP feature has a response time of around 1-2 μs and can detect currents up to 2.5 times the maximum rated current. However, it's essential to note that the OCP may not trigger immediately, and the device may still be damaged if the overcurrent condition persists. External protection mechanisms may be necessary for high-reliability applications.
  • The SLG59H1313C is rated for a maximum voltage of 13.2 V. While it can tolerate some voltage transients, it's not designed for high-voltage applications. If you need to operate at higher voltages, consider using a voltage regulator or a different device specifically designed for high-voltage applications.
  • Renesas provides a troubleshooting guide in their application note (APL-AN-115) for the SLG59H1313C. It covers common issues, such as overheating, overcurrent, and undervoltage lockout, and provides guidance on how to identify and resolve these problems.

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SLG59H1313C Overview

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