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SLG59M1557V - Renesas Electronics

Description: The SLG59M1557V is designed for load switching applications with ultra low quiescent current. The part comes with one 28.5 mΩ 1.0 A rated P‑channel MOSFET controlled by a single ON control pin. The product is packaged in an ultra‑small 1.0 mm x 1.0 mm package.

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PCB Footprints
SLG59M1557V - Renesas Electronics PCB footprint - Other - Other - STDFN 4L_2022
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3D Models
SLG59M1557V - Renesas Electronics  - 3D model - Other - STDFN 4L_2022
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SLG59M1557V Details

  • Manufacturer Part Number:

    SLG59M1557V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    STDFN-4 (1.0 x 1.0 mm)

  • Package Description:

    STDFN-4

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC4,.04,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    1 mm

SLG59M1557V Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or thermal management system. Additionally, consult Renesas' thermal management guidelines and application notes for specific recommendations.
  • Renesas recommends following the JEDEC J-STD-020D.1 standard for soldering conditions, which specifies a peak temperature of 260°C and a dwell time of 30 seconds. It's essential to consult the datasheet and application notes for specific soldering guidelines.
  • To troubleshoot issues with the SLG59M1557V, follow a systematic approach: 1) review the datasheet and application notes, 2) check the PCB layout and design, 3) verify the power supply and voltage regulator operation, 4) use oscilloscopes and logic analyzers to debug the circuit, and 5) consult Renesas' technical support resources and application notes for specific guidance.
  • Yes, the SLG59M1557V is a high-frequency device, and EMI/EMC considerations are crucial. Follow Renesas' guidelines for PCB layout, component selection, and shielding to minimize EMI/EMC issues. Additionally, consult the datasheet and application notes for specific recommendations on decoupling, filtering, and grounding.

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SLG59M1557V Overview

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