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SLP331M160A1P3 - Cornell Dubilier

Description: 330 µF 160 V Aluminum Electrolytic Capacitors Radial, Can - Snap-In 603mOhm 3000 Hrs @ 105°C

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SLP331M160A1P3 - Cornell Dubilier - PCB symbol
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PCB Footprints
SLP331M160A1P3 - Cornell Dubilier PCB footprint - Other - Other - 22 x 25mm
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3D Models
SLP331M160A1P3 - Cornell Dubilier - 3D model - Other - 22 x 25mm
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SLP331M160A1P3 Details

  • Manufacturer Part Number:

    SLP331M160A1P3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.40

  • Manufacturer:

    Cornell Dubilier Electronics Inc

  • YTEOL:

    6

  • Capacitance:

    330 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    22 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • ESR:

    603 mΩ

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.6893 mA

  • Length:

    25 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Snap-in

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    160 V

  • Ripple Current:

    1200 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    10 mm

  • Terminal Shape:

    SNAP-IN

SLP331M160A1P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SLP331M160A1P3 is a rectangular pad with dimensions of 33.5 mm x 16.5 mm, with a 1.5 mm diameter hole in the center for the pin. The pad should be solder-masked and have a non-solder-masked defined copper (NCMD) area around the pin to ensure proper soldering.
  • Yes, SLP331M160A1P3 is designed to withstand high-vibration environments. It's recommended to follow the manufacturer's guidelines and perform vibration testing according to IEC 60068-2-6) to ensure the component meets the required specifications.
  • SLP331M160A1P3 has a human body model (HBM) ESD rating of 25 kV. To handle ESD protection, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design.
  • The recommended soldering temperature for SLP331M160A1P3 is 260°C (500°F) with a maximum soldering time of 10 seconds. It's recommended to follow the manufacturer's soldering guidelines and use a solder with a melting point above 217°C (420°F).
  • Yes, SLP331M160A1P3 is designed to operate in humid environments. However, it's recommended to follow the manufacturer's guidelines for humidity testing and ensure the component meets the required specifications.

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SLP331M160A1P3 Overview

Use the download button to access the SLP331M160A1P3 schematic symbol, PCB footprint, and 3D model.
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