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SLP681M250H3P3 - Cornell Dubilier

Description: Cornell-Dubilier 680μF 250 V dc Aluminium Capacitor H3, SLP Series 1000 (Shelf) h, 3000 (Endurance) h 35 x 30mm

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SLP681M250H3P3 - Cornell Dubilier - PCB symbol
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PCB Footprints
SLP681M250H3P3 - Cornell Dubilier PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - 35*30
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3D Models
SLP681M250H3P3 - Cornell Dubilier - 3D model - Capacitor, Polarized Radial Diameter - 35*30
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SLP681M250H3P3 Details

  • Manufacturer Part Number:

    SLP681M250H3P3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.40

  • Manufacturer:

    Knowles CDE

  • YTEOL:

    6

  • Capacitance:

    680 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    35 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • ESR:

    293 mΩ

  • JESD-609 Code:

    e3

  • Leakage Current:

    1.2369 mA

  • Length:

    30 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Snap-in

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    250 V

  • Ripple Current:

    2000 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    10 mm

  • Terminal Shape:

    SNAP-IN

SLP681M250H3P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SLP681M250H3P3 is a rectangular pad with dimensions of 12.7mm x 7.62mm, with a 1.27mm diameter hole in the center for the terminal. The pad should be solder-mask defined and have a non-solder-mask-defined area around the terminal to ensure proper soldering.
  • Yes, the SLP681M250H3P3 is designed to withstand high-vibration environments. It has a rugged construction and is suitable for use in applications with vibration levels up to 20G.
  • Yes, the SLP681M250H3P3 is compatible with lead-free soldering processes. It has a tin-silver-copper (SnAgCu) termination that is compatible with lead-free soldering temperatures up to 260°C.
  • The maximum operating temperature range for the SLP681M250H3P3 is -40°C to +125°C. However, the device's performance may degrade at temperatures above 100°C, and it is recommended to derate the voltage and current ratings accordingly.
  • Yes, the SLP681M250H3P3 is designed to operate in humid or moist environments. It has a conformal coating that provides protection against moisture and humidity. However, it is recommended to follow proper storage and handling procedures to prevent moisture absorption.

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SLP681M250H3P3 Overview

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