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SMBT3904DW1T1G - onsemi

Description: Simplifies Circuit Design; Reduces Component Count; Available in 8 mm, 7-inch/3,000 Unit Tape and Reel; hFE, 100-300; Reduces Board Space; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS CompliantCapable

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SMBT3904DW1T1G - onsemi - PCB symbol
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PCB Footprints
SMBT3904DW1T1G - onsemi PCB footprint - Other - Other - SC-88(SOT-363) CASE 419B-02 ISSUE Y_FF
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3D Models
SMBT3904DW1T1G - onsemi - 3D model - Other - SC-88(SOT-363) CASE 419B-02 ISSUE Y_FF
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SMBT3904DW1T1G Details

  • Manufacturer Part Number:

    SMBT3904DW1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.2 A

  • DC Current Gain-Min (hFE):

    100

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transition Frequency-Nom (fT):

    300 MHz

SMBT3904DW1T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C (536°F) to prevent damage to the device.
  • Use ESD-safe materials and equipment during handling and assembly. Ground yourself and the device to prevent static electricity buildup. Use an ESD wrist strap or mat, and store the device in an ESD-safe package when not in use.
  • Store the device in a dry, cool place (−40°C to 30°C) with relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or contaminants.

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SMBT3904DW1T1G Overview

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