The recommended land pattern for SMD0805P050TSA is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
While SMD0805P050TSA is rated for operation up to 150°C, it's not recommended for high-temperature applications above 125°C. The device's performance and reliability may degrade above this temperature. Consult with Littelfuse Inc for specific guidance on high-temperature applications.
Handle SMD0805P050TSA by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
The recommended soldering profile for SMD0805P050TSA is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. Consult with Littelfuse Inc for specific soldering profile recommendations.
While SMD0805P050TSA is designed to operate in a variety of environments, it's not recommended for use in humid or wet environments without proper protection. The device's performance and reliability may degrade in the presence of moisture. Consider using conformal coating or potting to protect the component in humid or wet environments.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SMD0805P050TSA Overview
Use the download button to access the SMD0805P050TSA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SMD08,
or try a keyword search, such as Non-linear Resistors
