SMD1210B035TF footprint, schematic symbol and 3D model by Yageo Group

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SMD1210B035TF - Yageo Group PCB footprint - Fuses Chip - Fuses Chip - SMD1210B035TF

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Stock & Prices Price & Stock for SMD1210B035TF
Part Number SMD1210B035TF
Manufacturer Yageo Group
Pin Count 2
Part Category Fuse
Package Category Fuses Chip
Footprint Name Fuses Chip - SMD1210B035TF
Released Date Sep 18, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SMD1210B035TF Details

Manufacturer Part Number:
SMD1210B035TF
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
CHIP
Reach Compliance Code:
Compliant
Country Of Origin:
Mainland China, Taiwan
ECCN Code:
EAR99
HTS Code:
8533.40.80.70
Factory Lead Time:
21 Weeks, 1 Day
Manufacturer:
YAGEO Corporation
YTEOL:
8.25
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
2
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Height:
1 mm
Package Length:
3.43 mm
Package Style:
SMT
Package Width:
2.8 mm
Packing Method:
TR, 7 INCH
Reference Standard:
CUL; TUV; UL
Resistance:
0.32 Ω
Resistor Type:
PTC RESETTABLE FUSE
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Placement:
DUAL ENDED
Terminal Shape:
WRAPAROUND
Thermistor Application:
OVERCURRENT PROTECTION
Working Voltage:
6 V

SMD1210B035TF Frequently Asked Questions (FAQs)

The recommended land pattern for SMD1210B035TF is a rectangular pad with a size of 1.3mm x 2.5mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
SMD1210B035TF is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. It should be stored in a dry environment with a relative humidity of less than 30% and a temperature of less than 30°C. Before reflow soldering, the components should be baked at 125°C for 24 hours to remove any moisture.
The maximum reflow temperature for SMD1210B035TF is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The reflow profile should follow the JEDEC J-STD-020D standard.
SMD1210B035TF is a surface-mount device and can be used in high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
Yes, SMD1210B035TF is compatible with lead-free soldering. The component is designed to withstand the higher temperatures required for lead-free soldering and meets the requirements of the RoHS directive.

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